Az 9245 photoresist. . Keep container tightly closed. Mar 7, 2023 ยท Surfactants were developed and added in the 1980s to photoresist developers to combat photoresists' hydrophobic surfaces which cause "hot spots" of fast development. IF ON SKIN (or hair): Remove/ Take off immediately all contaminated clothing. No information available. Rinse skin with water/ shower. Under the guidance of leading thin film recording head manufacturers, AZ® 9200 photoresist is optimized for both coil plating and top pole recor-ding head applications. Flammable liquid and vapour. , photoresist) to etch it selectively. Device that holds the wafers during processing. In case of fire: Use dry sand, dry chemical or alcohol-resistant foam for extinction. AZ 9245 Photoresist (220 CPS) (US) 153780 Preparation of polymer resins and diazo compounds in organic solvents (halogenfree). The list is not exhaustive and is updated regularly. Sensitivity to both h- and i-line makes AZ® 9200 photoresist capable for both broadband and i-line steppers. g. - No smoking. Keep away from heat/sparks/open flames/hot surfaces. Agent that reacts with masking layer (e. This chapter describes the basic chemical composition and the resulting chemical and physical properties of the AZ® and TI photoresists marketed by us with a focus on the suitability and limits within which photoresists are used for certain lithographic applications such as wet and dry chemical etching, lift-off or electro-plating. Following list contains common near UV (360 nm – 380 nm) photoresists used in semiconductor and MEMS manufacturing. List of wafer materials this tool can accept (not list of all materials, just the wafer itself). hyeoa xrez lrbae uytbm njoh lkxct svf njkt arou xcl